This Week in PowerBites: USB-C Charging, New EV Devices


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USB-Focused Buck-Boost Charger ICs Deliver 50% Higher Density, 3X Faster Charging

Texas Instruments

Texas Instruments’ new family of highly integrated buck-boost battery-charger ICs include power-path management functionality, enabling them to support fast charging in a variety of applications with efficiencies of up to 97%. The BQ25790 and BQ25792 offer efficient charging and 10X lower quiescent current through USB Type-C and USB Power Delivery (PD) ports in small personal electronics, portable medical devices, and building-automation applications.

Both devices integrate the following components: switching metal-oxide semiconductor field-effect transistors (MOSFETs), a battery FET, current-sensing circuits, and a dual-input selector. This gives them the flexibility to charge batteries with one to four cells in a series and up to 5 A of charging current across the full input-voltage range (3.6 to 24 V) for USB Type-C and USB PD applications. The chargers’ integrated dual-input selector supports multiple power sources, including wireless, USB, barrel jack, and solar charging, while delivering the industry’s fastest charge—97% efficiency at 30 W. On-the-go (OTG) charging is supported with a bidirectional operation for forward and reverse charging.1

For more information, see www.ti.com/BQ25790-pr and www.ti.com/BQ25792-pr. The BQ25790 is now available in a 2.9- × 3.3-mm, 56-pin WCSP package. The BQ25792 comes in a 4- × 4-mm, 29-pin QFN package. Pricing starts at US$2.99 in 1,000-unit quantities. The BQ25790EVM evaluation module is available on TI.com for US$149.

1. To learn more, read the article, “Maximize power density with buck-boost charging and USB Type-C Power Delivery.”

USB-IF-Certified USB-CSolution Supports Fast Charging, Targets Embedded Designs

200630 Prod Mod St Micro Usb For EmbeddedSTMicroelectronics

STMicroelectronics introduced a chip set and a USB-IF-Certified reference design for USB-C charging products that support the USB Power Delivery (USB PD) standard, including its Programmable Power Supply (PPS) feature. The STM32G0 MCU and TCPP01-M12 enable an efficient and economical two-chip solution that can control and protect the USB PD-capable USB Type-C port as well as host the embedded application.

The TCPP01-M12 companion high-voltage analog front end integrates a charge pump to control the gate of an external power switch, which lets designers choose from economical N-channel MOSFETs that have lower RDS(on) than P-channel alternatives. There’s also a low-power mode that draws 0 nA when no cable is attached, enabling longer battery runtime.

Protection features built into the TCPP01-M12 include adjustable 5- to 22-V overvoltage protection on VBUS, short-to-VBUS protection on configuration channel pins, dead-battery management, and IEC 61000-4-2 ESD protection up to ±8 kV on VBUS and CC lines. The front end’s QFN12 package occupies 80% less board space than a discrete implementation.

To help accelerate product development and certification, ST offers a USB Implementers Forum (USB-IF) certified evaluation kit that can deliver up to 100 W to multiple PD USB Power Sinking Devices (PSD). The kit (USB-IF TID: 3036) combines ST’s Nucleo-G071RB and X-Nucleo-USBPDM1 development boards. The Nucleo-G071RB ($10.32) and X-Nucleo-USBPDM1 ($23.50) are available now from st.com or distributors. 

High-Rel Buck/Flyback Switcher ICs Steer Toward 400-V DC EV Apps

200706 Prod Mod Power Int Tn2 High Voltage SwitcherPower Integrations

An AEC-Q100-qualified version of Power Integrations’ LinkSwitch-TN2 switcher IC for buck or non-isolated flyback applications is now available. Featuring an integrated 750-V MOSFET, the new automotive-qualified LinkSwitch-TN2 IC provides simple and reliable power for EV subsystems connected to the high-voltage bus, including HVAC, climate control, battery management, battery heater, dc-dc converter, and on-board charger systems. The surface-mount device requires no heatsink, needs few external components, and occupies a very small PCB footprint.

Able to deliver up to 7 W in flyback mode (360 mA in buck), the LinkSwitch-TN2 provides a highly integrated solution that reduces the size and solution cost over the discrete-based converters commonly used today. It offers a wide input voltage range of 60 to 550 V dc, and efficient operation on the 400-V dc bus often implemented in electric vehicles. Accurate regulation is better than ±5% across line voltage, load, temperature, and component tolerances. 

Samples of the LNK3206GQ automotive-qualified LinkSwitch-TN2 IC are available with prices starting at $0.84 in 10,000-piece quantities. For datasheet and reference design documentation, visit https://ac-dc.power.com/products/linkswitch-family/linkswitch-tn2q/

1200-V SiC Half-Bridge Power Module Built for Next-Gen EVs and Trucks

200630 Prod Mod Infineon 1200 V Mosfet ModulesInfineon Technologies

Infineon Technologies’ latest addition to its EasyPACK module family—a 1200-V half-bridge SiC power module with an 8-mΩ/150-A current rating—is targeted at automotive applications with high efficiency and switching frequency requirements. Designed for 800-V systems in passenger and commercial EVs, the modules bring the company’s CoolSiC automotive MOSFET technology to its EasyPACK module architecture, which has proven its reliability during a decade of over-the-road service.

The new module is based on Infineon’s silicon-carbide trench MOSFET structure that enables a higher cell density than planar geometries. The resulting devices offer a best-in-class figure of merit, and can be operated at lower gate-oxide field strengths for higher reliability.

The first-gen CoolSiC devices used in the modules are optimized for use in traction inverters, with a focus on achieving the lowest possible conduction losses, especially under partial load conditions. When combined with the low switching losses of SiC MOSFETs, losses in inverter operation can be reduced by around 60% compared to silicon IGBTs. Thanks to its full qualification to the AQG324 standard, potential applications include HV/HV-DC-DC step-up converters, multi-phase inverters, and fast-switching auxiliary drives such as compressors for fuel cells.

Mass production of the EasyPACK CoolSiC Automotive MOSFET module FF08MR12W1MA1_B11A has begun. It will be available at distributors starting in September 2020. Click here for specifications, datasheets, and pricing.

MCU Ecosystem for Smart Metering Now Features wM-Bus Stack  

200630 Prod Mod St Micro Smart Meter 2

A wireless M-Bus (wM-Bus) software stack from STMicroelectronics and STACKFORCE leverages the integrated sub-GHz radio and multiple modulation schemes supported by STM32WL microcontrollers. The innovation helps cut bill-of-materials cost and enhance flexibility for developers of Smart Metering applications, such as electricity, gas and water metering.

Developed by STACKFORCE, the wM-Bus stack complies with most of EN 13757-3/-7, covering the upper layers of the Wireless M-Bus protocol stack, as well as the lower layers (EN 13757-4) and its wM-Bus modes S, T, and C used throughout Europe in the 868-MHz band. The mode N for operation at 169 MHz is an option, too. In addition, it meets several other metering standards, including the most common Open Metering System (OMS) specification, as well as more specific standards like Dutch Smart Meter Requirements (DSMR) or CIG Italian Gas Committee specifications.

Supported by the STM32 development ecosystem, STM32WL microcontrollers are ultra-low-power devices that use a range of ST technologies and design approaches to meet smart-meter designers’ needs. The sub-GHz radio inside STM32WL has a wide linear frequency range and dual power output. It can satisfy EN 300 220, FCC CFR 47 Part 15, ARIB T108, and other radio-equipment regulations, including China regulatory requirements to assist development of products for markets worldwide. Other key features include an integrated switched-mode power supply (SMPS) and hardware cryptographic accelerators.

The STACKFORCE wM-Bus stack is available immediately; go here. The wM-Bus over LoRaWAN stack will be available end of July 2020. STM32WL devices with up to 256-kB flash and a BGA73 package are in production now and are supported by ST’s 10-year product-longevity commitment. For more information, visit www.st.com/stm32wl.

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