Scalable Sensor Hub DSPs See a 2nd Generation


Through a new open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), CEVA hopes to accelerate technology innovation for DARPA programs. The partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all CEVA’s commercially available IPs, tools, and support to expedite their programs.

CEVA’s partnership with DARPA extends the reach of the company’s advanced DSPs, AI processors, and wireless IP to the DARPA research programs and its ecosystem. It’s hoped that CEVA’s broad and low-power platforms for 5G, Wi-Fi 6, Bluetooth, computer vision, and sound and motion sensing will help to accelerate innovation within DARPA.

The DARPA Toolbox initiative is a new, agency-wide effort aimed at providing open licensing opportunities with commercial technology vendors to the researchers behind DARPA programs. Through DARPA Toolbox, successful proposers will receive greater access to commercial vendors’ technologies and tools via pre-negotiated, low-cost, non-production access frameworks and simplified legal terms. For commercial vendors, DARPA Toolbox provides an opportunity to leverage the agency’s forward-looking research and a chance to develop new revenue streams based on programmatic achievements developed with their technologies.

CEVA, along with Arm and Verific, comprise a first wave of technology companies to sign commercial partnership agreements under DARPA Toolbox. As licensees of CEVA IP, DARPA researchers stand to benefit by having access to CEVA’s processors, tools, and support for technical areas that intersect with CEVA’s wireless-connectivity and smart-sensing portfolios. Key technologies offered by CEVA under the initiative include DSPs and software for 5G baseband processing, short-range connectivity, sensor fusion, computer vision, sound processing, and artificial intelligence.

CEVA, www.ceva-dsp.com



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